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Tin, gold, or maybe OSP? Which finish should you choose when designing a PCB?
Read more about Tin, HASL, ENIG, OSP - types of surface finishes on PCBs
Discover the "dark side" of the gold, its negative impact on the reliability of soldered connections.
Read more about Can gold be a problem in electronics?
Process improvement through the systematic implementation of small, positive changes.
Read more about Kaizen. The Japanese way of continuous improvement
Learn about the Head in Pillow (HiP) anomaly, a challenging problem in BGA soldering.
Read more about Head in Pillow - BGA Soldering Problem
The recommended standard for rework, repair, and modification of electronic devices.
Read more about IPC-7711/7721 - Rework, Repair, and Modification of Electronic Assemblies
Learn the easy way to detect special causes in SPC control charts.
Read more about The Nelson Rules: Tests for Special Causes in SPC Charts