Voids in solder joints: process-related, planar, Kirkendall, and others. Learn the details.
Read more about Voids in Solder Joints – Types, Causes, and Solutions
Learn about the causes of tin whiskers and effective methods for reducing them.
Read more about Tin Whiskers in Electronics: Causes and Solutions
Tin, gold, or maybe OSP? Which finish should you choose when designing a PCB?
Read more about Tin, HASL, ENIG, OSP - types of surface finishes on PCBs
Discover the "dark side" of the gold, its negative impact on the reliability of soldered connections.
Read more about Can gold finish be a problem in electronics?
Learn about the Head in Pillow (HiP) anomaly, a challenging problem in BGA soldering.
Read more about Head in Pillow - BGA Soldering Problem
The recommended standard for rework, repair, and modification of electronic devices.
Read more about IPC-7711/7721 - Rework, Repair, and Modification of Electronic Assemblies
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