Blog for a Super Engineer

Product quality and reliability don't happen by chance - they come from knowledge, methods, standards, and the people who apply them. Articles on this blog cover quality engineering, IPC standards, DFX methods, and reliability - with a particular focus on the electronics industry.

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Voids in Solder Joints – Types, Causes, and Solutions
5 min

Voids in Solder Joints – Types, Causes, and Solutions

Voids in solder joints: process-related, planar, Kirkendall, and others. Learn the details.

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Tin Whiskers in Electronics: Causes and Solutions
5 min

Tin Whiskers in Electronics: Causes and Solutions

Learn about the causes of tin whiskers and effective methods for reducing them.

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Can gold finish be a problem in electronics?
3 min

Can gold finish be a problem in electronics?

Discover the "dark side" of the gold, its negative impact on the reliability of soldered connections.

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Kaizen. The Japanese way of continuous improvement
4 min

Kaizen. The Japanese way of continuous improvement

Process improvement through the systematic implementation of small, positive changes.

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Head in Pillow - BGA Soldering Problem
4 min

Head in Pillow - BGA Soldering Problem

Learn about the Head in Pillow (HiP) anomaly, a challenging problem in BGA soldering.

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IPC-222x - Basic Standards for Electronics Design
4 min

IPC-222x - Basic Standards for Electronics Design

Learn about IPC standards for PCB design, shorten the design cycle, and improve quality.

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IPC - Global Electronics Association
2 min

IPC - Global Electronics Association

IPC has changed its name to the Global Electronics Association. Discover its new, broader scope of activities.

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