Voids in solder joints: process-related, planar, Kirkendall, and others. Learn the details.
Read more about Voids in Solder Joints – Types, Causes, and Solutions
Learn about the causes of tin whiskers and effective methods for reducing them.
Read more about Tin Whiskers in Electronics: Causes and Solutions
Draft version of the new AIAG & VDA SPC manual. What you need to know
Read more about AIAG VDA SPC - Yellow Volume, a draft version for review.
Tin, gold, or maybe OSP? Which finish should you choose when designing a PCB?
Read more about Tin, HASL, ENIG, OSP - types of surface finishes on PCBs
Discover the "dark side" of the gold, its negative impact on the reliability of soldered connections.
Read more about Can gold finish be a problem in electronics?
Process improvement through the systematic implementation of small, positive changes.
Read more about Kaizen. The Japanese way of continuous improvement
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